Author: Mary-Louise Hoffman|| Date Published: July 14, 2023
The Defense Advanced Research Projects Agency has started a program that aims to make microelectronic technology more resistant to the effects of radiation in a space environment by implementing a testing system for 3D heterogeneously integrated chips.
The project will involve stacking separately manufactured semiconductors and other components into a single package through heterogenous 3D integration.
“To speed the time to deployment, the goal is to make radiation testing an integral part of the design, fabrication, and development processes, instead of waiting until the end to do the final testing,” said David Abe, a DARPA program manager.
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