Microsoft (Nasdaq: MSFT) and IBM (NYSE: IBM) will get $24.5M in OTA awards under the initial phase of the Rapid Assured Microelectronics Prototypes program to further develop commercial microelectronics physical “back-end” design approaches with measurable security, DoD said Thursday.
Intel’s (Nasdaq: INTC) federal arm and Qorvo (Nasdaq: QRVO) will receive $172.7M in OTA funds under the second phase of the State-of-the-Art Heterogeneous Integration Prototype program. The two companies will demonstrate a new method to facilitate the heterogeneous integration and testing of advanced packaging platforms.
“Today’s awards support the Department’s mission to promote microelectronics supply chain security and accelerate U.S. development of the very best in circuit design, manufacturing, and packaging,” said Michael Kratsios, acting undersecretary of defense for research and engineering and U.S. chief technology officer.
“It’s critical for the DOD and American industry to work together in meaningful partnerships to ensure the United States leads the world in microelectronics far into the future,” added Kratsios, a 2020 Wash100 Award winner.
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