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Intel Adds Boeing, Northrop to DOD Commercial Chip Fabrication Program’s Phase 2

Intel’s (Nasdaq: INTC) foundry business has added Boeing (NYSE: BA) and Northrop Grumman (NYSE: NOC) to the second phase of the Department of Defense’s Rapid Assured Microelectronics Prototypes-Commercial program.

Northrop and Boeing will join IBM (NYSE: IBM), NVIDIA (Nasdaq: NVDA), Microsoft (Nasdaq: MSFT), Qualcomm (Nasdaq: QCOM) and other RAMP-C customers in building and producing test chips for product design tape-outs using Intel 18A process technology, intellectual property and electrical design and analysis tools as part of the program’s Phase 2, Intel said Tuesday.

The two defense contractors will also work with Synopsys (Nasdaq: SNPS) and Cadence (Nasdaq: CDNS) under the RAMP-C program, which enables semiconductor firms to produce integrated circuits and commercial products for critical defense systems.

In 2021, Intel was selected to build a commercial foundry infrastructure under the initial phase of the RAMP-C program. The company also works with DOD on RAMP and State-of-the-Art Heterogeneous Integration Prototype programs.

In October 2022, Intel Foundry Services established an alliance –  U.S. Military, Aerospace and Government Alliance – to improve semiconductor design and production to meet the requirements of national security and government applications.

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