The Boy Scouts of America to Honor Mac Curtis, President and CEO of Perspecta, During the Annual Good Scout Technology Award Luncheon on May 8th

Mac Curtis (L) and Phil Nolan (R)

Mac Curtis, president and chief executive officer of Perspecta, will be honored during the Boy Scouts of America National Capital Area Council’s Annual Good Scout Technology Award Luncheon on May 8th. You can find the registration page for the event here

The event will be held at the Tysons Corner Marriott and will begin with a light reception at noon. An awards luncheon will follow at 12:30 pm. Phil Nolan, general partner of Blue Delta Capital Partners, will serve as the chair for the event

The luncheon will celebrate Curtis’ commitment to advancing the technology sector while exemplifying the values of the Boy Scouts of America. Curtis joins a rich history of honorees who embody trustworthiness and loyalty in their professional and personal life. 

Proceeds from the event will benefit the National Capital Area Council, the largest youth organization in the Washington D.C. area. The Boy Scouts of America is consistently recognized as one of the most admirable non-profit organizations in the world. The young men and women of America will greatly benefit from the support of the GovCon industry. 

Don’t miss the Good Scout Technology Award Luncheon on May 8th. You can find the registration page for the event here. Even if you don’t plan to attend the luncheon, you can make a donation to the organization or take advantage of sponsorship opportunities for the event. 

You may also be interested in...

Vince Vlasho Defense Portfolio Lead AFS

Accenture Federal Services’ Vince Vlasho Talks Air Force Cloud ERP Program, Emerging Govt IT Market Trends

TYSONS CORNER, VA, October 22, 2020 — Vince Vlasho, a senior managing director and defense portfolio lead at Accenture Federal Services, told ExecutiveBiz in an interview that AFS' previous work with the U.S. Air Force on the Defense Enterprise Accounting and Management System has helped position the business to assist USAF in building a cloud-based common enterprise resource planning system.

Jim Brinker President Intel Federal

Intel, DoD Enter Chip Integration Project’s Second Phase; Jim Brinker Quoted

TYSONS CORNER, VA, October 22, 2020 — Intel (Nasdaq: INTC) will help the Department of Defense develop a multichip packaging system for the second phase of DoD's State-of-the-Art Heterogeneous Integration Prototype program, ExecutiveGov reported Oct. 2.