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Micross Secures $134M Army Advanced Packaging Ecosystem CTA Agreement

Micross Advanced Interconnect Technologies has received a $134.3 million other transaction authority agreement from the U.S. Army to develop a domestic, open-access ecosystem for 2.5D and 3D packaging production.

The packaging ecosystem will accommodate low-volume and high-mix production of 2.5D and 3D advanced system integration and packaging secure technologies, the Department of Defense said Monday.

Work will occur in Durham, North Carolina, through Nov. 2, 2028.

Army Contracting Command is the contracting activity and obligated $45.6 million in fiscal 2023 research, development, test and evaluation funds.

Micross offers bare die and wafers, custom packaging and assembly, advanced interconnect technology, component modification services, electrical and environmental testing and high-reliability microelectronics products to semiconductor device manufacturers and users.

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