The Defense Advanced Research Projects Agency has selected 11 teams from the commercial and academic sectors to kick off the preliminary phase of the Next-Generation Microelectronics Manufacturing program.
DARPA said Thursday the organizations will work on foundational research to help develop a center for producing 3D heterogeneously integrated microsystems under the NGMM Phase 0 effort.
Participants will also identify the processes, software and hardware tools, facility requirements and equipment to fabricate the 3DHI microsystems and conduct analyses to inform the program’s future phases.
The selected teams are Intel’s (Nasdaq: INTC) federal arm, Northrop Grumman’s (NYSE: NOC) space systems and mission systems business segments, RTX (NYSE: RTX), Applied Materials, BRIDG, HRL Laboratories, PseudolithIC, Teledyne Scientific & Imaging, Arizona State University and North Carolina State University.
“We’re confident these teams will help build a sustained path toward an R&D ecosystem that provides the framework for future 3DHI innovation,” said Carl McCants, special assistant to the DARPA director for the Electronics Resurgence Initiative.
“This is a high-risk mission to reimagine manufacturing science and create the U.S. infrastructure for tomorrow’s microelectronics by addressing the associated thermal, electrical, mechanical, and design challenges.”
NGMM serves as the foundation of DARPA’s ERI 2.0 initiative, which seeks to ensure U.S. leadership in cross-functional microelectronics research, development and production.
Join the 2023 Microelectronics Forum on July 25 to hear industry and government leaders share in-depth perspective on how increased domestic chip manufacturing will help elevate the country’s technological edge. Sign up now at the ExecutiveBiz events page to secure your spot for this important and timely forum!