The packaging ecosystem will accommodate low-volume and high-mix production of 2.5D and 3D advanced system integration and packaging secure technologies, the Department of Defense said Monday.
Work will occur in Durham, North Carolina, through Nov. 2, 2028.
Army Contracting Command is the contracting activity and obligated $45.6 million in fiscal 2023 research, development, test and evaluation funds.
Micross offers bare die and wafers, custom packaging and assembly, advanced interconnect technology, component modification services, electrical and environmental testing and high-reliability microelectronics products to semiconductor device manufacturers and users.
AeroVironment has tapped Robert “Rob” Smith as executive vice president and chief operating officer. Smith’s appointment, which will become official April 13, underscores…
GreyNoise Intelligence has launched Command and Control Detection, a new intelligence module designed to identify active cyber compromises using outbound…
BigBear.ai has named Jo Ann Bjornson as chief human resources officer and Alex Thompson as chief corporate affairs officer. The new leadership appointments…
