The packaging ecosystem will accommodate low-volume and high-mix production of 2.5D and 3D advanced system integration and packaging secure technologies, the Department of Defense said Monday.
Work will occur in Durham, North Carolina, through Nov. 2, 2028.
Army Contracting Command is the contracting activity and obligated $45.6 million in fiscal 2023 research, development, test and evaluation funds.
Micross offers bare die and wafers, custom packaging and assembly, advanced interconnect technology, component modification services, electrical and environmental testing and high-reliability microelectronics products to semiconductor device manufacturers and users.
C5MI has appointed Garth Sanginiti as chief growth officer, the Jacksonville Beach, Florida-based company announced Tuesday. What Will Sanginiti Do as Chief…
SOSi has been awarded a position on a $100 million indefinite-delivery/indefinite-quantity contract to provide strategic and technical services for the Enhanced…
