The packaging ecosystem will accommodate low-volume and high-mix production of 2.5D and 3D advanced system integration and packaging secure technologies, the Department of Defense said Monday.
Work will occur in Durham, North Carolina, through Nov. 2, 2028.
Army Contracting Command is the contracting activity and obligated $45.6 million in fiscal 2023 research, development, test and evaluation funds.
Micross offers bare die and wafers, custom packaging and assembly, advanced interconnect technology, component modification services, electrical and environmental testing and high-reliability microelectronics products to semiconductor device manufacturers and users.
The Defense Health Agency awarded a combined $8.07 billion in contracts to Humana Government Business, Evernorth Federal Services and Ipsos Public Affairs…
The Naval Information Warfare Center Pacific is soliciting proposals for the development and fielding of intelligence, surveillance and reconnaissance systems…
The Department of War is accelerating its push into unmanned systems, moving beyond experimentation toward large-scale production, streamlined acquisition and…
