The packaging ecosystem will accommodate low-volume and high-mix production of 2.5D and 3D advanced system integration and packaging secure technologies, the Department of Defense said Monday.
Work will occur in Durham, North Carolina, through Nov. 2, 2028.
Army Contracting Command is the contracting activity and obligated $45.6 million in fiscal 2023 research, development, test and evaluation funds.
Micross offers bare die and wafers, custom packaging and assembly, advanced interconnect technology, component modification services, electrical and environmental testing and high-reliability microelectronics products to semiconductor device manufacturers and users.
Client Solution Architects has appointed Ellen Barletto as chief growth officer, expanding her leadership responsibilities after nearly two decades with…
Brian Meyer, federal field chief technology officer at Axonius Federal, said cybersecurity asset management could help government agencies make dozens…
“Technology transformation company Red River has acquired Invictus International Consulting to expand its cybersecurity and enterprise modernization capabilities to support…
Synergy ECP, a software engineering, cybersecurity and systems engineering services provider, has acquired NetServices, a company offering secure, mission-focused technology services. The…
