The packaging ecosystem will accommodate low-volume and high-mix production of 2.5D and 3D advanced system integration and packaging secure technologies, the Department of Defense said Monday.
Work will occur in Durham, North Carolina, through Nov. 2, 2028.
Army Contracting Command is the contracting activity and obligated $45.6 million in fiscal 2023 research, development, test and evaluation funds.
Micross offers bare die and wafers, custom packaging and assembly, advanced interconnect technology, component modification services, electrical and environmental testing and high-reliability microelectronics products to semiconductor device manufacturers and users.
Redhawk Federal Solutions has acquired Twenty8 Technology to expand its data interoperability and artificial intelligence and machine learning engineering capabilities.…
Antenna Research Associates has appointed Jay Abendroth, a seasoned defense electronics executive, as chief growth officer to lead business development…
Precise Systems has appointed Michael “Mike” Risik as vice president of business development. The Lexington Park, Maryland-based company said Wednesday Risik will…
