Intel’s (Nasdaq: INTC) foundry business has added Boeing (NYSE: BA) and Northrop Grumman (NYSE: NOC) to the second phase of the Department of Defense’s Rapid Assured Microelectronics Prototypes-Commercial program. Northrop and Boeing will join IBM (NYSE: IBM), NVIDIA (Nasdaq: NVDA), Microsoft (Nasdaq: MSFT), Qualcomm (Nasdaq: QCOM) and other RAM...
Semiconductor chips underpin nearly every technology, weapon system and digital capability across the Department of Defense, making them increasingly important for a wide array of government and military missions. However, the United States’ production of these chips has fallen in recent decades, threatening our technological standing on the globa...
Joanne Martin, vice president of strategic operations at Leidos‘ (NYSE: LDOS) health group, has been promoted to senior VP of business development within the same business, according to her LinkedIn post published Friday. Martin previously worked at Science Applications International Corp. (NYSE: SAIC) and joined Leidos upon SAIC’s split int...
To maintain preparedness for current and future conflicts, the U.S. Army has embraced the “Army of 2030,” a momentous modernization effort designed to shift the service branch’s priorities to fit the characteristics of today’s international competition and deploy the technologies necessary to succeed in the evolving battlefield. The pla...
The Defense Advanced Research Projects Agency has started a program that aims to make microelectronic technology more resistant to the effects of radiation in a space environment by implementing a testing system for 3D heterogeneously integrated chips. DARPA said Thursday the Advanced Sources for Single-event Effects Radiation Testing effort will pu...
In recent years, space has become a warfighting domain as global tensions rise, new threats emerge and the peer competition heats up. Now, more than ever, the ability to collect, process, and understand intelligence from space is critical to gaining and maintaining technological dominance on the global stage. Under its eighth director, Vice Admiral...
Boeing (NYSE: BA) has partnered with Intel (Nasdaq: INTC) to develop next-generation aerospace industry capabilities that are enabled by advanced semiconductor technology. The collaboration is focused on the use of Intel 18A Silicon Complementary Metal-Oxide Semiconductor fabrication process to design and create secure and autonomous Boeing products...
Science Applications International Corp. (NYSE: SAIC) will engineer software for the U.S. Air Force’s B-52H Stratofortress bomber platform under a sole-source award valued at $19 million over five years. The service is using fiscal 2023 operations and maintenance funds to cover the initial obligated amount of $3.65 million on the firm-fixed-pr...
Guided by Secretary Frank Kendall’s Seven Operational Imperatives – space order of battle, operationally focused advanced battle management systems, moving target engagement, tactical air dominance, resilient basing, global strike and readiness to deploy and fight – the U.S. Department of the Air Force is preparing to launch a number...
The United States’ semiconductor chip manufacturing output has been steadily slipping over the last few decades, jeopardizing the country’s power in an increasingly critical industry on the global stage. But one key piece of legislation, the CHIPS and Science Act of 2022, aims to rewrite this narrative and place the U.S. back on top. The CH...
