Intel, DoD Enter Chip Integration Project’s Second Phase; Jim Brinker Quoted

Intel, DoD Enter Chip Integration Project’s Second Phase; Jim Brinker Quoted
Jim Brinker President Intel Federal

TYSONS CORNER, VA, October 22, 2020 — Intel (Nasdaq: INTC) will help the Department of Defense develop a multichip packaging system for the second phase of DoD's State-of-the-Art Heterogeneous Integration Prototype program, ExecutiveGov reported Oct. 2.

Jim Brinker, president and general manager of Intel's federal arm and a 2020 Wash100 Award recipient, said DoD could leverage the chipmaker's advanced semiconductor packaging platforms via the SHIP initiative as well as expand the defense supply chain and secure intellectual property.

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