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BAE, IDT Collaborate on Space-Grade Chip for Rapid Data Transfers

electronicsTYSONS CORNER, VA, October 22,  2015 — ExecutiveBiz reported Wednesday on BAE Systems and Integrated Device Technology announcing the development of a new microchip designed to rapidly transfer large volumes of data sets during outer space missions.

IDT said the offering makes use of its 240 Gbps CPS-1848 RapidIO switch embedded into BAE’s RADNET1848-PS product.

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David Smith
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