BAE Systems, Boeing (NYSE: BA) and IBM (NYSE: IBM) are working with the U.S. Air Force Research Laboratory to integrate electronic cooling systems into embedded computing devices and radio frequency power amplifiers, Military & Aerospace Electronics reported Friday.
John Keller writes the AFRL gave 30-month contracts to BAE and Boeing, with BAE awarded $2.4 million and Boeing for $2.1 million.
IBM won a $5 million contract to make building blocks for intra- and interchip evaporative microfluidic cooling, Keller reports.
Keller reports the Defense Advanced Research Projects Agency-sponsored project’s goal is to overcome design limits of size, weight and power consumption on thermal management electronic devices.
Boeing and BAE will work to remove one kilowatt per square centimeter heat flux from RF power amplifiers and embedded computing technologies for their part of the project, according to the report.